Motherboards White Papers
Intel D945GCLF2 Dual Core Mini-ITX Carputer Motherboard
Overview The Intel D945GCLF2, based on the Intel Atom, is finally released. One of the key features that caught the author's eye was the dual core Atom processor. Not only is it dual core, but its power usage is outstanding. It's estimated to use 4 watts under load while consuming milliwatts (thousandths of a watt) when idle. Being in a carputer, power consumption is a vital specification because one needs to figure out how large of a power supply one will need. The power consumption spec can also give one an idea of how much heat will be disappated, because after all, the power not used for computing will dissipate into heat.
| Publisher | IsYouGeekedUp.com | File Format | HTML |
|---|---|---|---|
| Date Published | October 2008 | ||
| Format | White Papers | ||
| Topics | |||
PC Hardware Troubleshooting Pack
Get TechRepublic's popular PC Troubleshooting Hardware Resource Guide, which includes a handy quick reference chart covering common PC hardware troubleshooting issues. This guide will quickly get you up to speed...
Intel D945GCLF2 Dual Core Mini-ITX Carputer Motherboard
The Intel D945GCLF2, based on the Intel Atom, is finally released. One of the key features that caught the author's eye was the dual core Atom processor. Not only is...
The Influence of Motherboard Specifications on the Evolution of the Desktop Form Factor
This white paper discusses trends in the desktop market specifically looking at new desktop sub form factors and the influences on their potential shipment growth. This paper looks at factors...
New Technology - ATA133 and DDR333 - Performance or Hype?
While this article deals mostly with the performance aspect of the KT333, these new motherboards are also equipped with some new features that make it more difficult to make a...
Tessera’s Unique Approach to Stacked IC Packaging
The demand for lower cost electronic products that offer smaller size, higher performance and increased functionality is placing significant pressure on the IC packaging community. Chip stacking appears to be an...



