Blades White Papers
Enabling Technologies for Power and Cooling
Overview In June 2006 Hewlett-Packard (HP) announced its next-generation blade portfolio, the BladeSystem c-Class. The new BladeSystem was designed to address some of the key Total Cost of Ownership (TCO) issues facing the datacenter, including server management costs, interconnect complexity, and power and cooling. As part of the BladeSystem c-Class, HP introduced three new technologies: HP Insight Control management, HP Virtual Connect architecture, and HP Thermal Logic technologies. These innovations play a central role in reducing overall datacenter operating expenses, and differentiate the BladeSystem c-Class system, both from competitive blade offerings and from rack-optimized server infrastructures. This paper focuses on HP Thermal Logic, a complete system solution to current power and cooling challenges.
| Publisher | IDG (International Data Group) | File Format | |
|---|---|---|---|
| Date Published | September 2006 | ||
| Format | White Papers | ||
| Topics | |||
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