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The Evolution of Build-Up Package Technology and Its Design Challenges

Overview This paper reviews Sequential Build-Up (SBU) laminate substrate development from its beginning in 1988. These laminated substrates are nonuniform structures composed of three elements: a core, build-up layers, and finishing layers. Each element has evolved to meet the demands of packaging applications. Thin-film processing has greatly enhanced the wiring capability of SBU laminate substrates and has made this technology very suitable for high-performance designs. This paper focuses on the challenges encountered by IBM during the design, manufacture, and reliability testing phases of development of SBU substrates as solutions for Application-Specific Integrated Circuit (ASIC) and microprocessor packaging applications.

Further White Paper Details
Publisher	IBM	File Format	PDF
Date Published	September 2005
Format	White Papers
Topics	N/A

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