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Power Delivery Design Issues for Hi-Speed USB on Motherboards
Overview This paper provides guidelines for the proper power delivery design for Hi-Speed USB ports and front panel headers on motherboards. The material covered here is broken up into three main categories: designing for droop test, designing for drop test, and front panel I/O considerations. The paper addresses the most common issues causing USB-IF electrical test failures and design methods to prevent such problems.
| Publisher | Intel | File Format | PDF, requires Acrobat Rdr 5 |
|---|---|---|---|
| Date Published | August 2002 | Downloads | 119 |
| Format | White Papers | ||
| Topics | |||
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