White Papers

Demountable 50 x 50 Pad Grid Array Interconnect System

Overview This paper reports on such a structure to allow a cabled 50 x 50 contact PGA to be connected by means of an anisotropic elastomeric anisotropic material to a 50 x 50 element transducer backing structure at 300 micron pitch, the acoustic half-wavelength normally used for 2.5 MHz imaging. Multiple flexible printed circuits provide the interconnect between coaxial cabling and a precision-drilled monolithic alumina substrate. The substrate is finished to provide a planar array of contact pads, each of which is used to contact gold wires embedded in a silicon medium which in turn connect to the backing electrodes of the transducer module. Using this approach, 97% of targeted interconnects were successfully accomplished. Acceptable pulse echo performance was demonstrated, suitable for diagnostic imaging.

Further White Paper Details
PublisherHP Labs File FormatPDF, requires Acrobat Rdr 5
Date PublishedAugust 2003
FormatWhite Papers   
Topics
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